The Best Nitrogen Solutions for Electronics & Technology Manufacturing

In the precision-driven world of electronics, technology, and semiconductor manufacturing, the quality of process gases plays a crucial role in ensuring product reliability and yield rates. Nitrogen, with its inert properties and ability to create oxygen-free environments, has become indispensable across multiple manufacturing processes. This article explores the critical applications of nitrogen in electronics manufacturing and how modern nitrogen generation solutions address industry challenges.

 

Below are just some of the applications for nitrogen in the electronics, technology, and semiconductor sectors.

Wave and Reflow Soldering
Wave and Reflow Soldering
Wave and Reflow Soldering
Purging and Blanketing
Nitrogen Purging and Blanketing Tanks
Purging and Blanketing
Thermal Processing: Annealing and Heat Treatment
Thermal Processing Annealing and Heat Treatment
Thermal Processing: Annealing and Heat Treatment
Hermetic Sealing
Hermetic Sealing for Electronic Components
Hermetic Sealing
Wave and Reflow Soldering
Wave and reflow soldering are fundamental processes in electronics assembly, where components are permanently attached to printed circuit boards (PCBs).
The process involves:

  • Pre-heating the PCB and components
  • Applying flux to remove oxides and facilitate bonding
  • Exposing components to molten solder
  • Controlled cooling to ensure joint integrity
  • Challenges

  • Oxidation of solder joints during heating - When molten solder reacts with oxygen, it forms weak, brittle connections. This leads to visual defects, unreliable bonds, and potential operational failures in the field. Without proper nitrogen blanketing, oxidation can increase scrap rates by up to 30% and force costly production slowdowns for rework. High-purity nitrogen (99.999%) creates an inert atmosphere that prevents oxidation, ensures consistent joint quality, and maintains production throughput.
  • Dross formation in solder bath - Exposure to oxygen causes rapid dross buildup on molten solder surfaces. This increases maintenance frequency, wastes expensive solder material, and can contaminate solder joints. Regular bath maintenance and production interruptions can reduce weekly throughput by 15-20%. Nitrogen blanketing significantly reduces dross formation, extending bath life and maintaining consistent soldering quality.
  • Thermal profile inconsistency - An uncontrolled atmosphere affects heat transfer efficiency and temperature uniformity. This creates inconsistent solder joint quality across boards and can damage heat-sensitive components. Poor thermal profiles can lead to 5-10% component failure rates. Nitrogen's superior heat transfer properties ensure uniform heating and protect sensitive components.
  •  

     

    Solutions

    Atlas Copco Specialty Rental nitrogen generation systems provide:

     

  • Controlled atmosphere with oxygen levels below 10 ppm
  • Reduction in dross formation by up to 90%
  • Improved solder joint quality and appearance
  • Reduced maintenance requirements
  • Consistent process control across production runs
  • Nitrogen Purging and Blanketing Tanks
    Purging and blanketing protect sensitive electronic components and manufacturing environments from contamination.
    The process includes:

  • Initial purging of production equipment
  • Continuous blanketing during manufacturing
  • Maintenance of positive pressure in critical areas
  • Protection of sensitive materials during storage
  • Challenges

  • Moisture contamination - Exposure to ambient humidity can degrade sensitive electronic components and materials. This causes oxidation, delamination, and long-term reliability issues. Even brief exposure can compromise entire production batches. Continuous nitrogen purging maintains a dry, inert environment that protects components throughout the manufacturing process. 
  • Particulate contamination - Airborne particles in manufacturing areas can settle on components and create defects. In cleanroom environments, this reduces yield rates and increases quality control rejections. Positive pressure nitrogen blanketing prevents particle infiltration and maintains cleanroom integrity. 
  • Process interruption - Breaks in protective atmospheres during material transfers or equipment maintenance expose products to contamination. Each interruption risks product quality and requires additional purge time. Properly designed nitrogen delivery systems maintain protection during normal production activities.
  • Solutions

    Atlas Copco’s on-site nitrogen generation solutions overcome these challenges by providing:

     

  • Nitrogen purities up to 99.999%
  • Continuous positive pressure maintenance
  • Reduced moisture exposure
  • Improved product consistency and yield rates
  • A more cost-effective approach than delivered nitrogen
  • Thermal Processing Annealing and Heat Treatment
    Rapid thermal processing (RTP) is a semiconductor manufacturing technique that heats silicon wafers to high temperature in a short amount of time.
    Thermal processing is crucial for:

  • Semiconductor wafer production
  • Component stress relief
  • Material property modification
  • Surface oxidation prevention

  • Potential problems can arise during annealing and heat treatment - unless precisely controlled.

    Challenges

  • Surface oxidation at high temperatures - Critical thermal processes like annealing and heat treatment are vulnerable to oxidation. Surface oxidation alters material properties and creates non-uniform results across production lots. This can affect semiconductor wafer properties and component performance. Nitrogen atmospheres prevent oxidation even at high temperatures. 
  • Temperature uniformity - Uneven heating leads to inconsistent material properties and stress distribution. This causes quality variations and potential failures during subsequent processing. Poor uniformity can reduce yield rates by 20-25%. Nitrogen's thermal properties help maintain consistent temperatures throughout the processing zone. 
  • Process control precision - Variations in atmosphere composition affect heating rates and cooling curves. This makes it difficult to maintain precise thermal profiles required for advanced electronics. Even minor deviations can compromise entire production batches. High-purity nitrogen enables precise control of critical thermal processes.
  •  

     

    Solutions

    Atlas Copco Specialty Rental nitrogen solutions offer the necessary control by ensuring:

     

  • Precise atmosphere control
  • Uniform heat distribution
  • Prevention of surface oxidation
  • Improved process reliability
  • Consistent material properties
  • Hermetic Sealing for Electronic Components
    Hermetic sealing protects sensitive electronic components from environmental factors through:

  • Complete encapsulation of components
  • Creation of controlled internal atmospheres
  • Long-term reliability assurance

  • Hermetic sealing is a critical manufacturing process and demands the following.

    Challenges

  • Seal integrity - Impurities or moisture trapped during sealing compromise long-term hermeticity. Failed seals lead to premature component failure and warranty claims. Rejection rates can reach 15% without proper atmospheric control. Pure nitrogen environments ensure contamination-free sealing and reliable hermeticity. 
  • Internal atmosphere quality - Trapped oxygen or moisture inside sealed components causes gradual degradation. This reduces product lifetime and reliability in the field. Component failures may not appear until months after production. Nitrogen purging before sealing creates an inert internal atmosphere for maximum component life. 
  • Process consistency - Variations in sealing atmosphere affect bond quality and hermeticity. This creates inconsistent results and requires increased quality testing. Production delays from additional testing reduce throughput. A stable nitrogen supply maintains consistent sealing conditions across production runs. 
  •  

    Solutions

    Atlas Copco’s nitrogen generation solutions for hermetic sealing processes provide several advantages:

     

  • High-purity nitrogen for consistent sealing environments
  • Improved product reliability
  • Extended component lifetime
  • Reduced warranty claims
  • Enhanced product performance
  •  

    Equipment Overview

    • PSA nitrogen generators achieving 99.999% purity

    • Membrane technology systems for up to 99.5% purity

    • High-pressure boosting capabilities up to 150 barg

    Operational Benefits

    • Flexible rental options for varying production needs

    • Quick deployment and installation

    • 24/7 technical support

    • Energy-efficient operation

    • Scalable solutions for different production volumes

    Industry-Specific Advantages

    • Meets semiconductor industry purity requirements

    • Supports various manufacturing processes

    • Reduces operational costs

    • Improves production reliability

    • Enhances quality control

    The industry's reliance on high-purity nitrogen continues to grow as component sizes shrink and quality requirements increase. Atlas Copco's comprehensive range of nitrogen generation solutions, available through flexible rental options, provides manufacturers with the reliability, purity, and efficiency needed to maintain competitive advantages in this demanding sector.

     

    For more information about our nitrogen generation solutions or to discuss your specific requirements, contact our technical team today.

    Rental industrial nitrogen generators

    Looking for a temporary supply of onsite nitrogen generation? We can support with rental nitrogen generators for a reliable onsite nitrogen generation up to 99.999% purity.