Scheugenpflug adhesive bonding, dispensing and potting technology

Q: Thermally conductive pastes

Thermally conductive pastes are high-viscosity potting media with a concentration of special fillers used for effectively dissipating heat between two components.

Q: Epoxy resins

Epoxy resins are reactive resins with which a stable, chemical-resistant plastic can be produced through the addition of additives. Epoxy-based casting resins feature excellent electrical properties and high hardness.

Q: Polyurethanes

Polyurethanes have an extremely wide and flexibly modifiable range of properties. PU potting compounds can be processed easily and feature protective properties similar to silicones and epoxies.

Q: Acrylates

Acrylates cure quickly, are known for their excellent adhesion and are used for sealing, bonding and potting applications in electronics manufacturing and the automotive sector. They are challenging to process and require a powerful dispensing system.

Q: Silicone-based resins

Silicone-based resins have exceptionally high thermal resistance and elasticity and are usually harmless to health.

Bonding, potting, sealing.

And dissipating heat where electronic components need to stay cool.
The Scheugenpflug product line offers a comprehensive technology portfolio of high-quality adhesive bonding, dispensing and potting solutions with outstanding automation capabilities.

Dispensing perfection

For a permanent bond

Display bonding with Scheugenpflug dispensing technology

Potting quality at its best

For maximum safety

Atlas Copco Technicians examine vacuum potted parts

Reliable thermal management

For long-lasting performance

Dispensing of Thermal Interface Materials (TIM) with Scheugenpflug equipment

Precise sealing contours For reliable protection

For reliable protection

Dispensing for power electronics: Precisely applied sealing contour on a DC / DC converter.

Technology portfolio of the Scheugenpflug product line

✓ Dispensing systems
✓ Material preparation & feeding systems
✓ Systems for potting under atmosphere and vacuum
✓ Inline and automation solutions

Electronic components such as sensors, PCBs, electrical coils and battery cells need to be protected from chemical or mechanical influences. The Scheugenpflug dispensing technology is used in many different sectors, including in the automotive and electronics industries as well as in telecommunications, medical technology and energy supply.

All dispensing products from Scheugenpflug

What are your potting requirements?

Bonding

Metering of industrial adhesives

Sealing

Sealing of silicone-based liquid gaskets (FIPG und CIPG)

Heat dissipation

Dispensing technology for abrasive thermal interface materials (TIM)

Dispensing under atmospheric conditions

Bubble free potting of electronics with low viscosity fluids

Dispensing under vacuum

Bubble free potting of electronics with low viscosity fluids

Encapsulation

Application of casting resin for protecting PCBs

Potting-optimized component design

With regard to potting, the design of electronic assemblies and components has a significant impact on economical and sustainable production. We support you with our potting expertise, innovative technology and decades of experience so you can pot your components as economically and reliably as possible and meet the demands on your products with high levels of quality.

Which products and workpieces are usually potted?

The range of industrially potted and bonded products and devices is vast. Read more about everyday dispensing technology in our Insights blog.

PCBs

Close up of a sealing application for power electronics electronics wiht dispensing technology from the Atlas Copco product line Scheugenpflug

Transformers & electrical coils

Complex parts like transformers and coils in front of a vacuum chamber

LEDs, sensors & ECUs

The right dispensing material for your application

Innovative dispensing systems and materials such as epoxy resins, polyurethanes and silicones don’t just hold everything in place, they also provide protection and extend the product’s service life – in vehicle electronics, everyday electronics and medical technology.

Polyurethane, silicone or epoxy? 1C or 2C materials? Thermally conductive, radiation or moisture-curing systems? With the wide variety of casting resins and corresponding processing methods available, users face a complex decision.

Material viscosity, temperature behavior, dispensing rate: there are numerous parameters for achieving optimum potting. To make sure that we offer you the best and most cost-effective solution for your individual adhesive bonding and potting task, we work closely with many well-known potting material manufacturers to test a wide variety of new materials.

Close-up of a gap filler application in a Scheugenpflug Dispensing Cell

Thermally conductive pastes are high-viscosity potting media with a concentration of special fillers used for effectively dissipating heat between two components.

Application of epoxy resin for component potting

Epoxy resins are reactive resins with which a stable, chemical-resistant plastic can be produced through the addition of additives. Epoxy-based casting resins feature excellent electrical properties and high hardness.

Vacuum potting of complex parts, such as electric coils and transformers, with a blue polyurethan

Polyurethanes have an extremely wide and flexibly modifiable range of properties. PU potting compounds can be processed easily and feature protective properties similar to silicones and epoxies.

Close up dispensing material for battery cell components

Acrylates cure quickly, are known for their excellent adhesion and are used for sealing, bonding and potting applications in electronics manufacturing and the automotive sector. They are challenging to process and require a powerful dispensing system.

Encapsulation: Close up of a PCB encapsulated with silicone-based resins

Silicone-based resins have exceptionally high thermal resistance and elasticity and are usually harmless to health.

Visit our Innovation Centers

Together with our experts, you will develop innovative solutions for the current challenges in electronics manufacturing.

Dispensing tests at our Innovation Center

Take advantage of our decades of experience right from the product development phase. Test your application using the well-equipped research and testing infrastructure of our Innovation Center. Get answers to your questions about materials, components, cycle times and the potting solution that suits you best.

More about our 13 Innovation Centers worldwide

In-house analytics & expert know-how

Efficient process development requires fast and reliable answers. Our Innovation Center delivers insights quickly – thanks to internal testing capabilities and the deep expertise of our team.

Adhesive bonding, dispensing and potting for electronics